3D Microelectronic Packaging
de Yan Li, Deepak Goyal
Materias
Ediciones (5)
- 3D Microelectronic Packaging (2021)
Springer Singapore Pte. Limited · inglés · ISBN 9789811570926
- 3D Microelectronic Packaging (2020)
Springer Singapore Pte. Limited · inglés · ISBN 9789811570896
- 3D Microelectronic Packaging (2018)
Springer · ISBN 9783319830865
- 3D Microelectronic Packaging (2017)
Springer · ISBN 9783319445847
- 3D Microelectronic Packaging (2016)
Springer · inglés · ISBN 9783319445861
