Thermal Stress and Strain in Microelectronics Packaging
de John Lau
Ediciones (3)
- Thermal Stress and Strain in Microelectronics Packaging (2012)
Springer London, Limited · inglés · ISBN 9781468477672
- Thermal Stress and Strain in Microelectronics Packaging (2012)
Springer · ISBN 9781468477696
- Thermal Stress and Strain in Microelectronics Packaging (2012)
Springer · ISBN 9781468477689
