John Lau
· 12 obras en el catálogo
Obras

Throughsilicon Vias For 3d Integration

Basics Fashion Design 09: Designing Accessories: Exploring the design and construction of bags, shoes, hats and jewellery

3D IC Integration and Packaging

Thermal Stress and Strain in Microelectronics Packaging
Advanced Copper-Gold Wire-Stud Interconnection Technologies
Basics Fashion Design 09 : Designing Accessories

Moda Tasariminda Aksesuar Tasarimi
Little Creature Classroom 2
Broth of Oblivion
Robot Kids Book
