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3D IC Integration and Packaging

Tapa de 3D IC Integration and Packaging

Número de Cutter-SanbornL366dEntrada «Lau» → 366 · marca de obra “d”

3D IC Integration and Packaging

Materias

Integrated circuits
Electronic packaging
Three-dimensional integrated circuits
Microelectronic packaging

Ediciones (1)

3D IC Integration and Packaging (2015)
McGraw-Hill Education · ISBN 9780071848060

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