Microelectronics Packaging

Materias

• Microelectronics
• Electronic packaging

Ediciones (1)

• Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III (1997)

  Springer · inglés · ISBN 9780412084614

Más obras de R.R. Tummala

Microelectronics packaging handbook