Stress induced phenomena in metallizationde P. S. HoMateriasThin film devicesMetallic filmsSemiconductorsElectrochemical metallizingLiquid crystal devicesCongressesDefectsElectrodiffusionAcoustic surface wave devicesAluminum filmsIntegrated circuitsEdiciones (1)Stress induced phenomena in metallization (1998)American Institute of Physics · inglésMás obras de P. S. HoAdvanced interconnects for ULSI technologyStress-induced phenomena in metallizationLow dielectric constant materials for IC applications