Second-Level Microelectronics Packaging
de Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Richard Bottoms, Kay, Linee Moore
Materias
Ediciones (1)
- Second Level Microelect Packaging (2001)
Charles River Media · ISBN 9780412154713
Más obras de Rao Tummala
