FFundamentals of Microsystems PackagingFundamentals of Microsystems Packagingde Rao TummalaEdiciones (1)Fundamentals of Microsystems Packaging (2019)McGraw-Hill Education · inglés · ISBN 9781259861550Más obras de Rao TummalaElectronic Packaging for High Reliability, Low Cost ElectronicsSSecond-Level Microelectronics PackagingSecond-Level Microelectronics PackagingIIntroduction to Microelectronics PackagingIntroduction to Microelectronics Packaging