Adhesive bonding in photonics assembly and packagingde B. G. YacobiMateriasAdhesivesDesign and constructionOptoelectronic devicesPhotonicsEdiciones (1)Adhesive bonding in photonics assembly and packaging (2003)American Scientific · inglésMás obras de B. G. YacobiMicroanalysis of solidsMicroanalysis of SolidsSSemiconductor MaterialsSemiconductor Materials