3D Interconnect Architectures for Heterogeneous Technologies
de Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck
Materias
Ediciones (2)
- 3D Interconnect Architectures for Heterogeneous Technologies (2023)
Springer International Publishing AG · inglés · ISBN 9783030982317
- 3D Interconnect Architectures for Heterogeneous Technologies (2022)
Springer International Publishing AG · inglés · ISBN 9783030982287