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3D Interconnect Architectures for Heterogeneous Technologies

Name: 3D Interconnect Architectures for Heterogeneous Technologies
ISBN: 9783030982287

Modeling and Optimization

Editorial
Autor	Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck

3D Interconnect Architectures for Heterogeneous Technologies (2022) — ISBN 9783030982287 | Cutter Number