Número de Cutter-SanbornL783mEntrada «Liu» → 783 · marca de obra “m”

Modeling and Simulation for Microelectronic Packaging Assembly

Name: Modeling and Simulation for Microelectronic Packaging Assembly
ISBN: 9781299314429

Manufacturing, Reliability and Testing

Autor	Sheng Liu, Liu, Yong
Editorial	Wiley & Sons, Incorporated, John
Fecha de publicación	2011
Idioma	inglés
ISBN-13	9781299314429
Número de Cutter	`L783m`

Modeling and Simulation for Microelectronic Packaging Assembly (2011) — ISBN 9781299314429 | Cutter Number