Semiconductor Packagingde Michael G. Pecht, Allan D. KrausMateriasSemiconductor industryPackagingEdiciones (1)Semiconductor Packaging (1997)John Wiley & Sons · inglés · ISBN 9780471181231Más obras de Michael G. PechtOptimum Cooling of Data CentersCopper Wire BondingRisk-Based Engineering
Nature-Inspired Computing Paradigms in Systems : Reliability, Availability, Maintainability, Safety and Cost and Prognostics and Health ... Systems