Photonics packaging and integration IVde Ray T. ChenMateriasCongressesPhotonicsOptical interconnectsOptoelectronic devicesMicroelectronic packagingDesign and constructionElectronic packagingEdiciones (2)Photonics packaging and integration IV (2004)SPIE · inglésPhotonics packaging and integration IV (2004)
PPhotonics packaging, integration, and interconnects VIIPhotonics packaging, integration, and interconnects VII
