Reliability, Yield, and Stress Burn-In
A Unified Approach For Microelectronics Systems Manufacturing & Software Development
Edición de la obra Reliability, Yield, and Stress Burn-In
| Autor | . Way Kuo, Wei-Ting Kary Chien, Taeho Kim |
|---|---|
| Editorial | Springer |
| Fecha de publicación | Mar 14, 2014 |
| Páginas | 420 |
| Formato | paperback |
| ISBN-13 | 9781461375968 |
| ISBN-10 | 1461375967 |
| Número de Cutter | K96r |