Package
Loose Leaf for Engineering Circuit Analysis with 1 Semester Connect Access Card
Edición de la obra Package
| Autor | William Hayt, Jack Kemmerly, Steven Durbin |
|---|---|
| Editorial | McGraw-Hill Education |
| Fecha de publicación | May 23, 2012 |
| Formato | loose leaf |
| ISBN-13 | 9780077704049 |
| ISBN-10 | 0077704045 |
| Número de Cutter | H426p |