Materials, Integration and Packaging Issues for High-Frequency Devices II
Symposium Held November 29-December 1, 2004, Boston, Massachussetts, U.S.A.
Edición de la obra Materials, Integration and Packaging Issues for High-Frequency Devices II
| Autor | Yong S. Cho |
|---|---|
| Editorial | Materials Research Society |
| Fecha de publicación | January 2005 |
| Idioma | inglés |
| Páginas | 270 |
| Formato | Hardcover |
| ISBN-13 | 9781558997813 |
| ISBN-10 | 1558997814 |
| Número de Cutter | C545m |