Materials, integration and packaging issues for high-frequency devices II
symposium held November 29-December 1, 2004, Boston, Massachusetts, U.S.A.
Edición de la obra Materials, integration and packaging issues for high-frequency devices II
| Autor | Yong S. Cho |
|---|---|
| Editorial | Materials Research Society |
| Fecha de publicación | 2005 |
| Lugar | Warrendale, Pa |
| Idioma | inglés |
| Páginas | 270 |
| ISBN-10 | 1558997814 |
| OCLC | 60376937 |
| LCCN | 2005280238 |
| Serie | Materials Research Society symposium proceedings ; · v. 833 · Materials Research Society symposia proceedings ; |