Edición de la obra Manufacturing Challenges in Electronic Packaging
| Autor | Y. C. Lee |
|---|---|
| Editorial | Springer US |
| Fecha de publicación | 1998 |
| Lugar | Boston, MA |
| Idioma | inglés |
| Páginas | 261 |
| Formato | [electronic resource] / |
| ISBN-13 | 9781461376590, 9781461558033 |
| ISBN-10 | 1461376599, 1461558034 |
| OCLC | 851818690 |
| Número de Cutter | L482m |
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.