Electronic packaging reliability
presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
Edición de la obra Electronic packaging reliability
| Autor | Luu T. Nguyen, Michael Pecht |
|---|---|
| Editorial | American Society of Mechanical Engineers |
| Fecha de publicación | 1993 |
| Lugar | New York |
| Idioma | inglés |
| Páginas | 131 |
| ISBN-10 | 0791810356 |
| OCLC | 29987465 |
| LCCN | 93093270 |
| Serie |