Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability
Proceedings of the 7th Electronic Meterials and
Edición de la obra Electronic Packaging: Materials and Processes to Reduce Package Cycle Time and Improve Reliability
| Autor | Colin Mackay |
|---|---|
| Editorial | Asm Intl |
| Fecha de publicación | December 1992 |
| Idioma | inglés |
| Páginas | 600 |
| Formato | Hardcover |
| ISBN-13 | 9780871704498 |
| ISBN-10 | 0871704498 |
| Número de Cutter | M153e |