Design-For-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Edición de la obra Design-For-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
| Autor | Springer |
|---|---|
| Editorial | Springer London, Limited |
| Fecha de publicación | 2013 |
| Idioma | inglés |
| ISBN-13 | 9783319023786 |
| Número de Cutter | S769d |