AAdvanced Manufacturing Process, Lead Free Interconnect MaterAdvanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2Edición de la obra Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2AutorC. Bailey, J. LiuEditorialEmerald Publishing LimitedFecha de publicación2006